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Lunghwa Wins Gold at Malaysia Pi-ENVEX International Engineering Invention and Innovation Exhibition

publish date : 2024-05-06 update date : 2024-07-29

Associate Professor Tsung-Hsin Lin and Professor Jeou-long Lee from the Department of Semiconductor Engineering at Lunghwa University of Science and Technology guided students from the department to participate in the 2024 Malaysia Pi-ENVEX International Engineering Invention and Innovation Exhibition. The team’s work, Preparation Method and Application of Copper Alloy Coating in Semiconductor Manufacturing Process, was awarded the gold medal, demonstrating their outstanding research and development capabilities.

The work of Tsung-Hsin Lin’s team involves preparing thin films of copper alloy using a co-sputtering method. These films exhibit low resistance, low leakage current, and good adhesion. They possess oxidation resistance, which can inhibit the reaction between copper and silicon, copper and tin, and antibacterial properties. They can be applied in various fields, such as copper wiring, flip-chip soldering, heat dissipation, and antibacterial medical equipment, indicating a wide range of applications.

Tsung-Hsin Lin pointed out that copper has excellent conductivity but quickly reacts chemically with silicon substrates, limiting its application. His research on preparing thin films of copper alloy using the co-sputtering method considers doping small amounts of substances into the copper plating layer without using barrier layers, thereby enhancing the stability of copper. He looks forward to collaborations with manufacturers to enter practical applications in the future.

Associate Professor Lin is enthusiastic about innovation and invention. He previously won three gold medals at the Croatia INOVA International Invention Exhibition in 2017, 2018, and 2019 for inventions such as Copper Plating Layer as a Buffer Layer and Its Fabrication Method, Copper Plating Layer with Good Thermal Conductivity and Illuminance and Its Preparation Method, and Antibacterial Copper Plating Film and Its Preparation Method. His related works also won gold medals at the Malaysia ITEX International Invention Exhibition in 2017, 2018, and 2023. He was awarded the 19th IIP Guoguang Medal for International Outstanding Inventors last year and was received by the President in April this year, recognizing his outstanding achievements.

In addition to congratulating the excellent performance of the faculty and students, President Tzu-Hsiang Ko of Lunghwa University expressed that the Department of Semiconductor Engineering is committed to cultivating practical talents in semiconductor technology. The development focus is on cultivating students’ knowledge and skills in midstream component processes and downstream packaging and testing in the semiconductor industry, enabling students to graduate with talents demanded by the semiconductor-related industries.

President Ko emphasized that the university has been actively promoting industry-academia collaboration and practical education that integrates theory with practice over the years. It emphasizes learning by doing and offers various entrepreneurship courses while providing interdisciplinary guidance and learning. The university encourages faculty and students to participate in competitions to accumulate experience, showcase research and development achievements, and look forward to continued exchanges with the industry to promote patent commercialization and create commercial product value.

The team led by Associate Professor Tsung-Hsin Lin, won the gold medal at the 2024 Malaysia PiENVEX International Engineering Invention and Innovation Exhibition.
The team led by Associate Professor Tsung-Hsin Lin, won the gold medal at the 2024 Malaysia PiENVEX International Engineering Invention and Innovation Exhibition.
Members of the Taiwanese team pose for a group photo.
Members of the Taiwanese team pose for a group photo.
Associate Professor Tsung-Hsin Lin welcomes the guests and explains the preparation method and application of copper alloy coating in the semiconductor manufacturing process.
Associate Professor Tsung-Hsin Lin welcomes the guests and explains the preparation method and application of copper alloy coating in the semiconductor manufacturing process.
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Secretariat Office, the Lunghwa University of Science and Technology
Contact: LI,CHIANG-SHENG
Office Phone: 82093211#2012
E-mail: lcs222@mail.lhu.edu.tw